Murata has unveiled the world’s first connectivity module to apply the new SGP.32 Remote SIM Provisioning (RSP) specification ...

Tenstorrent designs AI graph processors, high-performance RISC-V CPUs and configurable chiplets that combine hardware and ...

IAR has announced a partnership agreement with SiliconAuto accelerating the development of automotive technology.

Kioxia expects demand for flash memory to increase by about 2.7 times in the five years to 2028, driven by AI.

Nexperia has entered a strategic partnership with KOSTAL, an automotive supplier, to produce wide bandgap (WBG) devices that ...

Anglia Components, the UK and European distributor, has taken an unusual step following the loss of a major franchise – in ...

According to reports in the South Korean media Samsung’s DS Division is set to scale down on foundry production.

OMNIVISION has unveiled the OV0TA1B monochrome (mono)/infrared (IR) CMOS image sensor, currently the only solution that fits ...

Power Integrations has introduced a new member of its InnoMux-2 family of single-stage, independently regulated multi-output ...

LEMO has announced the introduction of the REDEL 2P High Voltage connectors, expanding its product range with a solution that provides 5kV on 26 or 34 contacts.

Infineon Technologies has introduced a new family of high-voltage discretes, the CoolGaN Transistors 650 V G5, further ...

TrendForce suggests that the global pursuit and anticipation of applications for solid-state batteries (SSBs) have ...