Barriers To Chiplet Sockets - Semiconductor Engineering
WEB4 hours ago · Barriers To Chiplet Sockets. Perfection sometimes stands in the way of progress, and there is evidence this may be happening with chiplets. It may be time to slow down and make real progress. September 30th, 2024 - By: Brian Bailey. Experts At The Table: Demand for chiplets is growing, but debate continues about whether standards …
Semiconductor Engineering - Deep Insights For Chip Engineers
WEBSeptember 12th, 2024 By Adam Kovac. Semiconductor Engineering was created by chip architects, engineers, journalists, end users, industry organizations & standards bodies to provide deep insights into the increasingly complex task of designing, testing, verifying, integrating and manufacturing semiconductors.
Data Routing In Heterogeneous Chip Designs - Semiconductor …
WEB12 hours ago · September 30th, 2024 - By: Ed Sperling. Ensuring data gets to where it’s supposed to go at exactly the right time is a growing challenge for design engineers and architects developing heterogeneous systems. There is more data moving around these chips with dozens of targets, which makes routing signals much more complicated.
Semiconductor Engineering Systems & Design - Sept. 2024
WEB4 days ago · Blue Cheetah’s Elad Alon discusses the three dominant chiplet product use cases emerging today — single-vendor, plug-and-play, and multi-vendor, in Enabling Innovative Multi-Vendor Chiplet-Based Designs. Arteris’ John Min explains how NoCs reduce the number of physical connections needed, helping to alleviate congestion, …
Chip Industry Week In Review - Semiconductor Engineering
WEB3 days ago · Chip Industry Week In Review. Google’s AlphaChip; 300mm fab equip spending; TSMC-EDA partnerships; $123M CHIPS Act; CXL memory standards; MIPI’s A-PHY v2.0; 12-stack HBM3E; LLMs for chip design and manufacturing; India fab. September 27th, 2024 - By: The SE Staff. Global spending on 300mm fab equipment is expected to …
Blog Review: Sept. 25 - Semiconductor Engineering
WEB5 days ago · Blog Review: Sept. 25. PCIe 6.1 flow control; formal basics; cloud EDA boosts time to market; testing PCB interconnects with boundary scan; open-source RNG for AI. Cadence’s Mamta Rana digs into how PCIe 6.1 ECN builds on the FLIT-based architecture introduced in PCIe 6.0, further optimizing flow control mechanisms to handle increased …
Emerging Technologies Driving Heterogeneous Integration
WEB6 days ago · Emerging Technologies Driving Heterogeneous Integration. New architectures, opportunities, and challenges as chipmakers move from monolithic architectures to chiplets. As chips are disaggregated into chiplets, more features are being added into these devices that chipmakers were unable to include in the past due to reticle size limits and the ...
SEMI's Year-End Total Semiconductor Equipment Forecast — OEM ...
WEBDecember 14th, 2022 - By: SEMI. Global sales of total semiconductor manufacturing equipment by original equipment manufacturers are forecast to reach a new high of $108.5 billion in 2022, rising 5.9% from the previous industry record of $102.5 billion in 2021, SEMI announced today in its Year-End Total Semiconductor Equipment Forecast – OEM ...
Power Semis Usher In The Silicon Carbide Era - Semiconductor …
WEBAug 21, 2023 · Many thousands of power semiconductor modules already are in use in electric vehicles for on-board charging, traction inversion, and DC-to-DC conversion. Today, most of those are fabricated using silicon-based IGBTs. A shift to silicon carbide-based MOSFETs doubles the power density and accelerates switching speed in a smaller and …
Semiconductor Device Manufacturing Process Challenges And …
WEBDec 7, 2023 · Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be broken down into several key steps. The first step is wafer preparation. A silicon wafer is chosen as the starting material for the semiconductor ...